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期刊


ISSN0946-7076
刊名Microsystem technologies
参考译名微系统技术：传感器，致动器与系统集成
收藏年代1998～2024

关联期刊参考译名收藏年代
Journal of Information Storage and Processing Systems存储与处理系统信息杂志2000～2001


全部

1998 1999 2000 2001 2002 2003
2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023 2024

2001, vol.7, no.1 2001, vol.7, no.2 2001, vol.7, no.3 2001, vol.7, no.4 2001, vol.7, no.5-6

题名作者出版年年卷期
Equations of exposure time and X-ray mask absorber thickness in the LIGA processK. H. Gil; S. S. Lee; Y. Youm20012001, vol.7, no.1
Non-adhesive direct bonding of tiny parts by means of ultraprecision trapezoid microgroovesY. Takeuchi; O. Miyagawa; T. Kawai; K. Sawada; T. Sata20012001, vol.7, no.1
SU-8 as resist material for deep X-ray lithographyC. Cremers; F. Bouamrane; L. Singleton; R. Schenk20012001, vol.7, no.1
Gas permeability of adhesives and their application for hermetic packaging of microcomponentsA. Gerlach; W. Keller; J. Schulz; K. Schumacher20012001, vol.7, no.1
Laser bending of etched silicon microstructuresE. Gartner; J. Fruhauf; U. Loschner; H. Exner20012001, vol.7, no.1
Assembly of hybrid integrated micro-optical modules using passive alignment with LIGA mounting elements and adhesive bonding techniquesA. Gerlach; P. Ziegler; J. Mohr20012001, vol.7, no.1
Fabrication method of spacers with high aspect ratio-used in a field emission display (FED)S. Park; M. Kim20012001, vol.7, no.1
Microcomposite electroforming for LIGA technologyM. -C. Chou; H. Yang; S. H. Yeh20012001, vol.7, no.1
A flip-chip LIGA assembly technique via electroplatingL. -W. Pan; L. Lin; J. Ni20012001, vol.7, no.1
Consumption-related development in microelectroformingN. N. Issaev; A. G. Schrodt; C. Khan Malek20012001, vol.7, no.1



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