哈尔滨工业大学邓宗全院士团队
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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004~2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2005, vol.5, no.1 2005, vol.5, no.10 2005, vol.5, no.2 2005, vol.5, no.3 2005, vol.5, no.4 2005, vol.5, no.5
2005, vol.5, no.6 2005, vol.5, no.7 2005, vol.5, no.8 2005, vol.5, no.9

题名作者出版年年卷期
Lead-Free solder finishes - What is best and what works?Bob Willis20052005, vol.5, no.7
Accelerating cure of silicone adhesivesBill Riegler; Henry Sarria20052005, vol.5, no.7
Packaging proliferation: challenge for the programming industryMiguel Hernandez20052005, vol.5, no.7
Low cost, high speed reel-to-reel RFID tag assemblyChih-Min Cheng; Vito Buffa; Wanda O'Hara; Bo Xia; Jayesh Shah20052005, vol.5, no.7
Brightening horizon: Revenues improve and forecasts receive minor upward adjustmentsWalt Custer20052005, vol.5, no.7
Neology utilizes innovative RFID manufacturing solution case studyChris Hunt20052005, vol.5, no.7