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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2007, vol.7, no.1 2007, vol.7, no.10 2007, vol.7, no.11 2007, vol.7, no.12 2007, vol.7, no.2 2007, vol.7, no.3
2007, vol.7, no.4 2007, vol.7, no.5 2007, vol.7, no.6 2007, vol.7, no.7 2007, vol.7, no.8 2007, vol.7, no.9

题名作者出版年年卷期
Case Study: One company's lead-free journeyTrevor Galbraith20072007, vol.7, no.10
Chip packaging 2.0 - User-definable chip pinout packaging for optimized PCB designTrevor Galbraith20072007, vol.7, no.10
Pin-in-hole reflow (PIHR) and lead-free solder jointsTrevor Galbraith20072007, vol.7, no.10
Solid first half but financial concerns prompt cautionJon Custer; Walt Custer20072007, vol.7, no.10
Package on package (PoP) process development and reliability evaluationJonas Shoberg; David A. Geiger; Todd Castello; Dongkai Shangguan20072007, vol.7, no.10
System integration services: a new role for the EMSCarsten Barth20072007, vol.7, no.10
Changeover optimization in electronics assemblyMika Johnsson; Tommi Puustelli20072007, vol.7, no.10
How to estimate solder joint reliability: Part 2Werner Engelmaier20072007, vol.7, no.10



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