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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2007, vol.7, no.1 2007, vol.7, no.10 2007, vol.7, no.11 2007, vol.7, no.12 2007, vol.7, no.2 2007, vol.7, no.3
2007, vol.7, no.4 2007, vol.7, no.5 2007, vol.7, no.6 2007, vol.7, no.7 2007, vol.7, no.8 2007, vol.7, no.9

题名作者出版年年卷期
Via hole mounting on surface pads or not?Bob Willis20072007, vol.7, no.2
The validation of SAC305 and SnCu-based solders at the contract assembler levelPeter Biocca; Carlos Rivas20072007, vol.7, no.2
Process improvement with selective solderJohn Weisheit; Tom Barnard20072007, vol.7, no.2
Evaluation of wafer bumping stencilsScott F. Popelar; Robert A. Niemet20072007, vol.7, no.2
Integrating strategic alliances in product development and manufacturingLarry Fleming20072007, vol.7, no.2
Voids in solder joints - reliabilityWerner Engelmaier20072007, vol.7, no.2



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