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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2007, vol.7, no.1 2007, vol.7, no.10 2007, vol.7, no.11 2007, vol.7, no.12 2007, vol.7, no.2 2007, vol.7, no.3
2007, vol.7, no.4 2007, vol.7, no.5 2007, vol.7, no.6 2007, vol.7, no.7 2007, vol.7, no.8 2007, vol.7, no.9

题名作者出版年年卷期
Jetting for semiconductor and electronic component packagingAlec J. Babiarz20072007, vol.7, no.4
Information flow as a tool for cost reductionScott Mauldin20072007, vol.7, no.4
Carrier tape for lead-free assembly of FPCBsY. M. Lim; K. Y. Park; Korea Taconic20072007, vol.7, no.4
Rework of package on package in lead-free arrayPaul Wood20072007, vol.7, no.4
Turkey - Full of eastern promiseTrevor Galbraith20072007, vol.7, no.4
The progress and pitfalls of China's technical standardsByron Wu20072007, vol.7, no.4



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