哈尔滨工业大学邓宗全院士团队
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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004~2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2007, vol.7, no.1 2007, vol.7, no.10 2007, vol.7, no.11 2007, vol.7, no.12 2007, vol.7, no.2 2007, vol.7, no.3
2007, vol.7, no.4 2007, vol.7, no.5 2007, vol.7, no.6 2007, vol.7, no.7 2007, vol.7, no.8 2007, vol.7, no.9

题名作者出版年年卷期
What is LEADOUT online training?Bob Willis20072007, vol.7, no.7
Medical electronics pose unique challengesAnthony Primavera; Roger Roberts; Ravi Subrahmanyan20072007, vol.7, no.7
Market trends for 3D stackingEric Mounier20072007, vol.7, no.7
Liquid tin corrosion and lead free wave solderingJim Morris; Matthew J. O'Keefe; Martin Perez20072007, vol.7, no.7
Achieving solder joint reliability in a lead-free world: Part 2Trevor Galbraith20072007, vol.7, no.7