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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2007, vol.7, no.1 2007, vol.7, no.10 2007, vol.7, no.11 2007, vol.7, no.12 2007, vol.7, no.2 2007, vol.7, no.3
2007, vol.7, no.4 2007, vol.7, no.5 2007, vol.7, no.6 2007, vol.7, no.7 2007, vol.7, no.8 2007, vol.7, no.9

题名作者出版年年卷期
Process defects can be a thing of the pastBob Willis20072007, vol.7, no.8
Obtaining and controlling reflow oven cooling ratesFred Dimock20072007, vol.7, no.8
Soft landing in progress; seat belt sign still onWalt Custer20072007, vol.7, no.8
Achieving solder joint reliability in a lead-free world: part 2Werner Engelmainer20072007, vol.7, no.8
Roxtron - the next generation of SMT nozzlesHywel Jones20072007, vol.7, no.8
Optical silicones for use in harsh operating environmentsBill Riegler20072007, vol.7, no.8
Beating the chip counterfeitersKeith Bryant20072007, vol.7, no.8



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