哈尔滨工业大学邓宗全院士团队
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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004~2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2008, vol.8, no.1 2008, vol.8, no.10 2008, vol.8, no.11 2008, vol.8, no.12 2008, vol.8, no.2 2008, vol.8, no.3
2008, vol.8, no.4 2008, vol.8, no.5 2008, vol.8, no.6 2008, vol.8, no.7 2008, vol.8, no.8 2008, vol.8, no.9

题名作者出版年年卷期
Introduction to microsectioning printed circuit boardsBob Willis20082008, vol.8, no.11
Test data requirements or assessment or alternative Pb-free solder alloysHelen Holder; Gregory Henshall; Aileen Moloney20082008, vol.8, no.11
Lasers - a flexible tool for PCB and device reworkBob Wettermann20082008, vol.8, no.11
Can lead-free and lead-containing PCBs be cleaned in a single process?Stefan Strixner20082008, vol.8, no.11