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期刊


ISSN0946-7076
刊名Microsystem technologies
参考译名微系统技术：传感器，致动器与系统集成
收藏年代1998～2024

关联期刊参考译名收藏年代
Journal of Information Storage and Processing Systems存储与处理系统信息杂志2000～2001


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2004 2005 2006 2007 2008 2009
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2009, vol.15, no.1 2009, vol.15, no.10/11 2009, vol.15, no.12 2009, vol.15, no.2 2009, vol.15, no.3 2009, vol.15, no.4
2009, vol.15, no.5 2009, vol.15, no.6 2009, vol.15, no.7 2009, vol.15, no.8 2009, vol.15, no.9

题名作者出版年年卷期
A silicon test chip for the thermomechanical analysis of MEMS packagingsSoeren Majcherek; Thomas Leneke; Soeren Hirsch20092009, vol.15, no.1
Macroscopic invisible cablesNicola M. Pugno20092009, vol.15, no.1
Poly-Si extensions and etching residues as a reliability riskPeter Jacob20092009, vol.15, no.1
TSV constraints related to temperature excursion, pressure during molding, materials used and handling loadsTomasz Falat; Kazimierz Friedel; Norman Marenco; Stephan Warnat20092009, vol.15, no.1
Changes in the microstructure of materials and their impact on reliability: experiments and modelingAndreas Brandmair; Thomas Bohme; Wolfgang H. Muller20092009, vol.15, no.1
Assessment of testing methodologies for thin-film vacuum MEMS packagesQian Li; Hans Goosen; Fred van Keulen; Joost van Beek; Guoqi Zhang20092009, vol.15, no.1
Design limitations related to conductive anodic filament formation in a micro-worldAntonio Caputo; Laura J. Turbini; Doug D. Perovic20092009, vol.15, no.1
Interlayer cooling potential in vertically integrated packagesT. Brunschwiler; B. Michel; H. Rothuizen; U. Kloter; B. Wunderle; H. Oppermann; H. Reichl20092009, vol.15, no.1
How to extract continuum materials properties for (lead-free) solders from tensile tests and nanoindentation experimentsW. H. Muller; H. Worrack; J. Sterthaus; J. Villain; J. Wilden; A. Juritza20092009, vol.15, no.1
Effects of fatigue and damage on the hysteresis loops of ferroelectric ceramicsShouwen Yu; Li Yu20092009, vol.15, no.1
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