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期刊


ISSN0946-7076
刊名Microsystem technologies
参考译名微系统技术:传感器,致动器与系统集成
收藏年代1998~2024

关联期刊参考译名收藏年代
Journal of Information Storage and Processing Systems存储与处理系统信息杂志2000~2001


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2009, vol.15, no.1 2009, vol.15, no.10/11 2009, vol.15, no.12 2009, vol.15, no.2 2009, vol.15, no.3 2009, vol.15, no.4
2009, vol.15, no.5 2009, vol.15, no.6 2009, vol.15, no.7 2009, vol.15, no.8 2009, vol.15, no.9

题名作者出版年年卷期
Research development of measuring methods on the tribology characters for movable MEMS devices: a reviewZhanshe Guo; Zhou Feng; Shangchun Fan; Dezhi Zheng; Haihan Zhuang20092009, vol.15, no.3
Self-sensing actuators with passive damping for adaptive vibration control of hard disk drivesK. W. Chan; W. H. Liao20092009, vol.15, no.3
Evaluation of multi-Gbps serial link using wire-bonded multiple exposed pads (M-pad) leadframe packageNansen Chen; Hongchin Lin20092009, vol.15, no.3
Computational fluid dynamics for effects of coolants on on-chip cooling capability with carbon nanotube micro-fin architecturesYi Fan; Xiaolong Zhong; Johan Liu; Teng Wang; Yan Zhang; Zhaonian Cheng20092009, vol.15, no.3
The study of integrated LED-backlight plate fabricated by micromachining techniqueChao-Heng Chien; Zhi-Peng Chen20092009, vol.15, no.3
Numerical and experimental validation of out-of-plane resonance closed formulas for MEMS suspended plates with square holesGiorgio De Pasquale; Aurelio Soma20092009, vol.15, no.3
Micro injection molding of micro gear using nano-sized zirconia powderP. C. Yu; Q. F. Li; J. Y. H. Fuh; T. Li; P. W. Ho20092009, vol.15, no.3
Surface activation using remote plasma for silicon to quartz wafer bondingR. E. Belford; S. Sood20092009, vol.15, no.3
Electroplating a magnetic core for micro fluxgate sensorChun-Lei Kang; Gang Liu; Jian-Zhong Yang; Long-Hua Liu; Ying Xiong; Yang-Chao Tian20092009, vol.15, no.3
Compounding, micro injection moulding and characterisation of polycarbonate-nanosized alumina-composites for application in microopticsThomas Hanemann; Jurgen Hausselt; Eberhard Ritzhaupt-Kleissl20092009, vol.15, no.3
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