哈尔滨工业大学邓宗全院士团队
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期刊


ISSN1540-2800
刊名Power Electronics Technology
参考译名功率变换与智能运转：电力电子系统
收藏年代2003～2013

关联期刊参考译名收藏年代
Power Conversion and Intelligent Motion功率变换与智能运转1998～2002
PCIM Power Electronic Systems功率变换与智能运转：电力电子系统 


全部

2003 2004 2005 2006 2007 2008
2009 2010 2011 2012 2013

2009, vol.35, no.1 2009, vol.35, no.10 2009, vol.35, no.11 2009, vol.35, no.2 2009, vol.35, no.3 2009, vol.35, no.4
2009, vol.35, no.5 2009, vol.35, no.6 2009, vol.35, no.7 2009, vol.35, no.8 2009, vol.35, no.9

题名作者出版年年卷期
An Active Approach to Cooling High-Power Applications: SynJet (synthetic jet) technology is a new, high-reliability active cooling solution for high-powered electronic systemsJIM BALTHAZAR20092009, vol.35, no.11
Thin-Film Chip Resistors Challenge Traditional Thick-Film Devices: Thin-film chip resistors are comparable in cost and have higher power ratings than their more traditional thick-film cousinsKORY SCHROEDER; BRIAN MCCABE20092009, vol.35, no.11
Selecting Die Attach Technology for High-Power ApplicationsJONATHAN HARRIS; MICHAEL MATTHEWS20092009, vol.35, no.11
HBLED Driver Controls Up to 18 LEDs In Series: A controller IC drives high-brightness LEDs for a variety of indoor, outdoor, and automotive applications. Its LED system design is simplified by the use of an online programSAM DAVIS20092009, vol.35, no.11
Design Concepts: AC Adapters for Notebook Computers - Part 1JHIH-DA HSU; CHI-SHENG CHAO20092009, vol.35, no.11
Hybrid Heat Sink Technology Promises Temperature Uniformity: A recently proposed hybrid jet impingement/micro-channel heat sink technology would extract high heat-flux densities and control a target object's temperature distributionSAM DAVIS20092009, vol.35, no.11
High-Rel Intelligent Power Modules Support 1,700-V, 3,600-A AppsRALF HERRMANN20092009, vol.35, no.11
SiC and GaN Vie for Slice of the Electric Vehicle PieSAM DAVIS20092009, vol.35, no.11
Power MOSFET Breaks the 1-mΩ R_(DS(ON)) Barrier: A new power MOSFET's 0.99-mΩ R_(DS(ON)) enhances its use in static-switch or load-switch applicationsSam Davis20092009, vol.35, no.11



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