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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2009, vol.9, no.1 2009, vol.9, no.10 2009, vol.9, no.11 2009, vol.9, no.12 2009, vol.9, no.2 2009, vol.9, no.3
2009, vol.9, no.4 2009, vol.9, no.5 2009, vol.9, no.6 2009, vol.9, no.7 2009, vol.9, no.8 2009, vol.9, no.9

题名作者出版年年卷期
Fatigue and creep wearout failures in electronics - a historical retrospectiveWerner Engelmaier20092009, vol.9, no.9
Special packaging feature: IC packaging and interconnection technologies' 4th dimension challengeJoseph Fjelstad20092009, vol.9, no.9
Special packaging feature: Imbedded Component/Die Technology: Is it ready for mainstream design applications?Casey H. Cooper; Mark T. McMeen; Jim D. Raby20092009, vol.9, no.9
A baseline study of stencil and screen print processes for wafer backside coatingJeff Schake20092009, vol.9, no.9
PoP (package on package) and vapor phase technologyDan Coada20092009, vol.9, no.9
IC packaging technology retrospective - part 7 Through silicon via (TSV) technology-another 'More than Moore' solutionJoe Fjelstad20092009, vol.9, no.9
IC packaging technology retrospective - part 6: Packaging solutions enter the third dimensionJoe Fjelstad20092009, vol.9, no.8
Solder joint reliability: acceleration transforms and acceleration factorsWerner Engelmaier20092009, vol.9, no.8
A peek into Singapore's high tech manufacturing marvelDebasish Choudhury20092009, vol.9, no.8
Tribute to Dr. Steven K. CaseTrevor Galbraith20092009, vol.9, no.8
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