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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2009, vol.9, no.1 2009, vol.9, no.10 2009, vol.9, no.11 2009, vol.9, no.12 2009, vol.9, no.2 2009, vol.9, no.3
2009, vol.9, no.4 2009, vol.9, no.5 2009, vol.9, no.6 2009, vol.9, no.7 2009, vol.9, no.8 2009, vol.9, no.9

题名作者出版年年卷期
Bottom terminated component (BTC) technology follows growing market demand for lower profile packagingJoe Fjelstad20092009, vol.9, no.10
What you need to know before buying your AOI solutionPaul Groome20092009, vol.9, no.10
Which tools are best for SMT rework-conduction or convection?Paul Wood20092009, vol.9, no.10
Continually improving global demandWalt Custer; Jon Custer-Topai20092009, vol.9, no.10
Business process management for improved productivity and customer satisfactionMaths E. Andersson20092009, vol.9, no.10
Reduced electricity use reduces production cost, lowers carbon footprintMike Payne20092009, vol.9, no.10
Pb-free solder creep-fatigue reliability models updated and extendedWerner Engelmaier20092009, vol.9, no.10
Intrusive reflow with SNIC pasteBob Willis20092009, vol.9, no.10



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