哈尔滨工业大学邓宗全院士团队
      文献服务与管理平台

期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
Test试验 


全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2009, vol.9, no.1 2009, vol.9, no.10 2009, vol.9, no.11 2009, vol.9, no.12 2009, vol.9, no.2 2009, vol.9, no.3
2009, vol.9, no.4 2009, vol.9, no.5 2009, vol.9, no.6 2009, vol.9, no.7 2009, vol.9, no.8 2009, vol.9, no.9

题名作者出版年年卷期
Hot air solder leveling in the lead-free eraKeith Sweatman20092009, vol.9, no.4
Bottom reached, 'turning point' in sight?Walt Custer; Jon Custer-Topai20092009, vol.9, no.4
Vapor phase vs. convection reflow in RoHS-compliant assemblyDan Coada20092009, vol.9, no.4
Conformal coating process control and inspectionBob Willis20092009, vol.9, no.4
Conquering SMT stencil printing challenges with today's miniature components: Is electroform technology the right solution?Robert F. Dervaes; Jeff Poulos; Scott Williams20092009, vol.9, no.4



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  机械工业信息研究院 2018-2024