哈尔滨工业大学邓宗全院士团队
      文献服务与管理平台

期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
Test试验 


全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2009, vol.9, no.1 2009, vol.9, no.10 2009, vol.9, no.11 2009, vol.9, no.12 2009, vol.9, no.2 2009, vol.9, no.3
2009, vol.9, no.4 2009, vol.9, no.5 2009, vol.9, no.6 2009, vol.9, no.7 2009, vol.9, no.8 2009, vol.9, no.9

题名作者出版年年卷期
Solder paste test printBob Willis20092009, vol.9, no.8
Establishing a precision stencil printing process for miniaturized electronics assemblyChris Anglin20092009, vol.9, no.8
Second half of 2009-off to a better start globallyWalt Custer; Jon Custer-Topai20092009, vol.9, no.8
Moving AOI beyond the grey worldShoich Rashed20092009, vol.9, no.8
Tribute to Dr. Steven K. CaseTrevor Galbraith20092009, vol.9, no.8
A peek into Singapore's high tech manufacturing marvelDebasish Choudhury20092009, vol.9, no.8
Solder joint reliability: acceleration transforms and acceleration factorsWerner Engelmaier20092009, vol.9, no.8
IC packaging technology retrospective - part 6: Packaging solutions enter the third dimensionJoe Fjelstad20092009, vol.9, no.8



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  机械工业信息研究院 2018-2024