哈尔滨工业大学邓宗全院士团队
      文献服务与管理平台

期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
Test试验 


全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2010, vol.10, no.10 2010, vol.10, no.11 2010, vol.10, no.12 2010, vol.10, no.2 2010, vol.10, no.3 2010, vol.10, no.4
2010, vol.10, no.5 2010, vol.10, no.6 2010, vol.10, no.7 2010, vol.10, no.8 2010, vol.10, no.9

题名作者出版年年卷期
Case study: Agile EMS provider delivers tier-one information and controlJason Spera20102010, vol.10, no.9
A better dispense tipFrank Murch; Eiji Ito20102010, vol.10, no.9
Fast heat-curing adhesives for packagingKarl Blitzer; Rene Tobisch-Haupt20102010, vol.10, no.9
Predicting PCB delamination in lead-free assemblyGeert Willems; Piet Watte20102010, vol.10, no.9
Raised copper contact technologies for IC packaging - a path to improved reliabilityJoe Fjelstad20102010, vol.10, no.9
Fundamentals of fatigueWerner Engelmaier20102010, vol.10, no.8
Benefits of non-restricted feeder locationsDenny Yingling20102010, vol.10, no.8
Caution in the face of high growthWalt Custer; Jon Custer-Topai20102010, vol.10, no.8
Matching the cleaning agent to the flux residueMike Bixenman20102010, vol.10, no.8
Evaluating the accuracy of a non-destructive thermocouple attach method for area-array package profilingTim Grove; S. Marxian; Brian O'Leary20102010, vol.10, no.8
1234567



国家科技图书文献中心  全球文献资源网  京ICP备05055788号-26  机械工业信息研究院 2018-2024