哈尔滨工业大学邓宗全院士团队
      文献服务与管理平台

期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004~2024

关联期刊参考译名收藏年代
Test试验 


全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2010, vol.10, no.10 2010, vol.10, no.11 2010, vol.10, no.12 2010, vol.10, no.2 2010, vol.10, no.3 2010, vol.10, no.4
2010, vol.10, no.5 2010, vol.10, no.6 2010, vol.10, no.7 2010, vol.10, no.8 2010, vol.10, no.9

题名作者出版年年卷期
3D - the once and future solution for electronic interconnectionsJoe Fjelstad20102010, vol.10, no.10
21st century manufacturing software solutionsMatt Wuensch20102010, vol.10, no.10
How to use 3D solder paste inspection (SPI) to improve SMT printing processAnxin Ning20102010, vol.10, no.10
Parts managementFrank Frank; Nolan Johnson20102010, vol.10, no.10
THT in-line inspection: contradiction or greater efficiency?Jens Kokott20102010, vol.10, no.10
How to increase production and reduce costs through optimized dynamic schedulingBill Crowley20102010, vol.10, no.10
Singapore's holistic approach benefits both contract manufacturers and OEMsSusan Mucha20102010, vol.10, no.10