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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2010, vol.10, no.10 2010, vol.10, no.11 2010, vol.10, no.12 2010, vol.10, no.2 2010, vol.10, no.3 2010, vol.10, no.4
2010, vol.10, no.5 2010, vol.10, no.6 2010, vol.10, no.7 2010, vol.10, no.8 2010, vol.10, no.9

题名作者出版年年卷期
The printed circuit - the unsung bellwether of electronics manufacturing evolutionJoe Fjelstad20102010, vol.10, no.8
Evaluating the accuracy of a non-destructive thermocouple attach method for area-array package profilingTim Grove; S. Marxian; Brian O'Leary20102010, vol.10, no.8
Matching the cleaning agent to the flux residueMike Bixenman20102010, vol.10, no.8
Caution in the face of high growthWalt Custer; Jon Custer-Topai20102010, vol.10, no.8
Benefits of non-restricted feeder locationsDenny Yingling20102010, vol.10, no.8
Fundamentals of fatigueWerner Engelmaier20102010, vol.10, no.8



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