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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2011, vol.11, no.1 2011, vol.11, no.10 2011, vol.11, no.11 2011, vol.11, no.2 2011, vol.11, no.3 2011, vol.11, no.4
2011, vol.11, no.5 2011, vol.11, no.6 2011, vol.11, no.7 2011, vol.11, no.8 2011, vol.11, no.9

题名作者出版年年卷期
0201 & 01005 component assembly issues - still waiting to happenBob Willis20112011, vol.11, no.9
The wild world of IC packaging options and its implicationsJoe Fjelstad20112011, vol.11, no.9
Case Study: Validating the effectiveness of your cleaning process with ion chromatographyTrevor Galbraith20112011, vol.11, no.9
Case Study: Full-service EMS provider adds AXI for full coverageTrevor Galbraith20112011, vol.11, no.9
Outlook for 2H'11 and beyondWalt Custer; Jon Custer-Topai20112011, vol.11, no.9
Reducing graping through process optimizationEd Briggs; Ron Lasky20112011, vol.11, no.9
Manufacturing execution systems vs. ERP/MRP: The myths and realities of coexistence in today's electronics manufacturing environmentBUI Crowley20112011, vol.11, no.9
Thoughts on outsourcing, Harry Potter, and disinformationJennifer Read20112011, vol.11, no.8
What if...?Joe Fjelstad20112011, vol.11, no.8
Training structure the key to successful contentBob Willis20112011, vol.11, no.8
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