哈尔滨工业大学邓宗全院士团队
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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004~2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2011, vol.11, no.1 2011, vol.11, no.10 2011, vol.11, no.11 2011, vol.11, no.2 2011, vol.11, no.3 2011, vol.11, no.4
2011, vol.11, no.5 2011, vol.11, no.6 2011, vol.11, no.7 2011, vol.11, no.8 2011, vol.11, no.9

题名作者出版年年卷期
Integrated PCB design-through-manufacturing processes increase profitsJohn Isaac20112011, vol.11, no.10
Cleaning non-hermitically sealed components on assembled PWBsMike Bixenman20112011, vol.11, no.10
SIPLACE emerges strongTrevor Galbraith20112011, vol.11, no.10
Comparing outsourcing to Mexico and China for midmarket OEMs seeking a regional solutionEric Miscoll20112011, vol.11, no.10
Difficult portion of the business cycleWalt Custer; Jon Custer-Topai20112011, vol.11, no.10
Area ratios of 0.40 and 0.48 with nano-coated stencilsCarmina Lantzsch20112011, vol.11, no.10
Electronics in 3D - Evolution continues...Joe Fjelstad20112011, vol.11, no.10
In-Sight 5100 provides optical control of lasered codes on PCBs at RommelTrevor Galbraith20112011, vol.11, no.10
Counterfeit component introduction & testing: Goods in inspection not a thing of the past!Bob Willis20112011, vol.11, no.10