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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
Test试验 


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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2011, vol.11, no.1 2011, vol.11, no.10 2011, vol.11, no.11 2011, vol.11, no.2 2011, vol.11, no.3 2011, vol.11, no.4
2011, vol.11, no.5 2011, vol.11, no.6 2011, vol.11, no.7 2011, vol.11, no.8 2011, vol.11, no.9

题名作者出版年年卷期
X-ray increases product quality at Mentzer ElectronicsTrevor Galbraith20112011, vol.11, no.3
Thermal shock reliabilityWerner Engelmaier20112011, vol.11, no.3
The flying probe platform: Short notes on the history and philosophy of testTrevor Galbraith20112011, vol.11, no.3
Company profile - FCT AssemblyTrevor Galbraith20112011, vol.11, no.3
Monitoring quality in plastic pipes: SMART EU project updateBob Willis20112011, vol.11, no.3
Embedding components into PCBs needs accurate, reliable placementEric Klaver20112011, vol.11, no.3
Low-cost boundary-scan tools help SMEs to reduce test costsPeter van den Eijnden20112011, vol.11, no.3
Recovery still on track but with a few concernsWalt Custer; Jon Custer-Topai20112011, vol.11, no.3
Using X-ray to crack the case of the counterfeit componentKathryn Cramer20112011, vol.11, no.3
MIDs in our midst: A look at molded interconnection devicesJoe Fjelstad20112011, vol.11, no.3
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