哈尔滨工业大学邓宗全院士团队
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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004~2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
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2018 2019 2020 2021 2022 2023
2024

2012, vol.12, no.1 2012, vol.12, no.10 2012, vol.12, no.11 2012, vol.12, no.12 2012, vol.12, no.2 2012, vol.12, no.3
2012, vol.12, no.4 2012, vol.12, no.5 2012, vol.12, no.6 2012, vol.12, no.7 2012, vol.12, no.8 2012, vol.12, no.9

题名作者出版年年卷期
The Paperless Factory: Using technology to improve efficiency in high mix and CTO productionWally Johnson20122012, vol.12, no.10
How do ceramic capacitors fail? Let me count the waysCraig Hillman20122012, vol.12, no.10
Basic lead formats for IC packagesJoe Fjelstad20122012, vol.12, no.10
How to select a conformal coating materialLee Hitchens; Phil Kinner20122012, vol.12, no.10