哈尔滨工业大学邓宗全院士团队
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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004~2024

关联期刊参考译名收藏年代
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2024

2012, vol.12, no.1 2012, vol.12, no.10 2012, vol.12, no.11 2012, vol.12, no.12 2012, vol.12, no.2 2012, vol.12, no.3
2012, vol.12, no.4 2012, vol.12, no.5 2012, vol.12, no.6 2012, vol.12, no.7 2012, vol.12, no.8 2012, vol.12, no.9

题名作者出版年年卷期
Performance monitoring cuts waste for maximum efficiencyMichael Ford20122012, vol.12, no.12
PCB assembly cleaning & contamination opportunities aheadTrevor Galbraith20122012, vol.12, no.12
Special Feature - Vast majority of electronic companies not yet ready for U.S. conflict minerals lawTrevor Galbraith20122012, vol.12, no.12
Keep it tight: understanding hermeticitvCraig Hillman20122012, vol.12, no.12
Enough... Will we ever achieve it in IC packaging?Joe Fjelstad20122012, vol.12, no.12
The requirement for 2D & 3D inspection technology in a single AOI platformBrian D'Amico20122012, vol.12, no.12