哈尔滨工业大学邓宗全院士团队
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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004~2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
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2018 2019 2020 2021 2022 2023
2024

2012, vol.12, no.1 2012, vol.12, no.10 2012, vol.12, no.11 2012, vol.12, no.12 2012, vol.12, no.2 2012, vol.12, no.3
2012, vol.12, no.4 2012, vol.12, no.5 2012, vol.12, no.6 2012, vol.12, no.7 2012, vol.12, no.8 2012, vol.12, no.9

题名作者出版年年卷期
Overcoming the challenges of the QFN packageKarl Seelig; Kevin Pigeon20122012, vol.12, no.2
3D packaging using carbon nanotubesDi Jiang; Teng Wang; Kjell Jeppson; Lilei Ye; Johan Liu20122012, vol.12, no.2
Case Study: A systems approach to reducing time and cost in project launchTrevor Galbraith20122012, vol.12, no.2
National Electronics Week South Africa returns to Johannesburg for its second editionTrevor Galbraith20122012, vol.12, no.2
Understanding OccamJoe Fjelstad20122012, vol.12, no.2
Juki is 25,000 shipments strongTrevor Galbraith20122012, vol.12, no.2
Zentech Manufacturing: A small business with large idealsTrevor Galbraith20122012, vol.12, no.2
Material selection and parameter optimization for reliable TMV PoP assemblyBrian Roggeman; David Vicari; Lee Smith; Ahmer Syed20122012, vol.12, no.2
Case Study: Water soluble flux residue and product reliability…a connection?Ravi Parthasarathy; Bob Bibeau20122012, vol.12, no.2