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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2012, vol.12, no.1 2012, vol.12, no.10 2012, vol.12, no.11 2012, vol.12, no.12 2012, vol.12, no.2 2012, vol.12, no.3
2012, vol.12, no.4 2012, vol.12, no.5 2012, vol.12, no.6 2012, vol.12, no.7 2012, vol.12, no.8 2012, vol.12, no.9

题名作者出版年年卷期
High-density board designs need ultra-reliable placementSjef van Gastel20122012, vol.12, no.3
Challenges for step stencils with design guidelinesCarmina Lantzsch20122012, vol.12, no.3
Advanced packaging trends: Miniaturization and cleaning requirementsMike Bixenman20122012, vol.12, no.3
Printed electronics - Something old, something newJoe Fjelstad20122012, vol.12, no.3
Printing using micro stencils for LGA/QFN reworkBob Willis20122012, vol.12, no.3



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