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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2013, vol.13, no.1 2013, vol.13, no.10 2013, vol.13, no.2 2013, vol.13, no.3 2013, vol.13, no.4 2013, vol.13, no.5
2013, vol.13, no.6 2013, vol.13, no.7 2013, vol.13, no.8 2013, vol.13, no.9

题名作者出版年年卷期
Coating solutions to challenges in printed circuit boards (PCBs)A. Ghanbari; T. Von Werne20132013, vol.13, no.10
Tools to assure compatibility of conformal coatings and no-clean lead-free solder pastesEmmanuelle Guene; Celine Puechagut20132013, vol.13, no.10
A nano silver replacement for high lead solders in semiconductor junctionsKeith Sweatman; Tetsuro Nishimura; Teruo Komatsu20132013, vol.13, no.10
Weak summer but encouraging signs for autumnWalt Custer; Jon Custer-Topai20132013, vol.13, no.10
3D: Benefits and challengesJoe Fjelstad20132013, vol.13, no.10
Pitching for IC packagesSandra L. Winkler20132013, vol.13, no.10



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