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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004~2024

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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2013, vol.13, no.1 2013, vol.13, no.10 2013, vol.13, no.2 2013, vol.13, no.3 2013, vol.13, no.4 2013, vol.13, no.5
2013, vol.13, no.6 2013, vol.13, no.7 2013, vol.13, no.8 2013, vol.13, no.9

题名作者出版年年卷期
A R.O.S.E. is still a ROSE? Ionically it makes a difference!Graham Naisbitt; Alasdair Naisbitt20132013, vol.13, no.4
Electronic assemblies and moisture loadingManfred Suppa20132013, vol.13, no.4
February "bump in the road" hopefully followed by spring upturnWalt Custer; Jon Custer-Topai20132013, vol.13, no.4
Cu pillar becoming interconnect of choice for flip chipTrevor Galbraith20132013, vol.13, no.4
What's the secret to tin whiskers?Craig Hillman20132013, vol.13, no.4
Design-for-Environment: Innovating for people, planet and profits Harvey StoneHarvey Stone20132013, vol.13, no.4
Thermal design validation techniquesJoe Fjelstad20132013, vol.13, no.4
Two surfaces are better than oneKen Chiavone20132013, vol.13, no.4