哈尔滨工业大学邓宗全院士团队
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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004~2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2018, vol.18, no.1 2018, vol.18, no.10 2018, vol.18, no.11 2018, vol.18, no.12 2018, vol.18, no.2 2018, vol.18, no.3
2018, vol.18, no.4 2018, vol.18, no.5 2018, vol.18, no.6 2018, vol.18, no.7 2018, vol.18, no.8 2018, vol.18, no.9

题名作者出版年年卷期
How to Make Your Factory SmarterZAC ELLIOTT20182018, vol.18, no.9
SMTA "Members of Distinction" Award Winners AnnouncedTrevor Galbraith20182018, vol.18, no.9
IPC E-Textiles Committee releases White Paper on washability of E-TextilesTrevor Galbraith20182018, vol.18, no.9
TANAKA's new packaging for storing power bonding wireTrevor Galbraith20182018, vol.18, no.9
Jennie S. HwangJennie S. Hwang20182018, vol.18, no.9
Still Solid Growth but at a Slowing PaceWALT CUSTER; JONATHAN CUSTER20182018, vol.18, no.9
Novel Mid-Temperature Alloy for Enabling Solder Processing Temperature Hierarchy in SMT AssemblySATHISH KUMAR; NICHOLAS HERRICK; RANJIT PANDHER; MORGANA RIBAS; AMIT PATEL; GYAN DUTT20182018, vol.18, no.9
How to Use Imaging Colorimeters to Improve OLED Display Production Testing Efficiency and YieldsTrevor Galbraith20182018, vol.18, no.9
Networking, Digitization, Big Data, Industry 4.0 - Three Steps to Achieving the TargetJENS KOKOTT20182018, vol.18, no.9
New records for electronica India and productronica IndiaTrevor Galbraith20182018, vol.18, no.8
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