哈尔滨工业大学邓宗全院士团队
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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004~2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2018, vol.18, no.1 2018, vol.18, no.10 2018, vol.18, no.11 2018, vol.18, no.12 2018, vol.18, no.2 2018, vol.18, no.3
2018, vol.18, no.4 2018, vol.18, no.5 2018, vol.18, no.6 2018, vol.18, no.7 2018, vol.18, no.8 2018, vol.18, no.9

题名作者出版年年卷期
Reliability of Electronics - The Role of Solder Joint ReliabilityJENNIE S. HWANG20182018, vol.18, no.10
Effect of Voids on Thermo-Mechanical Reliability of Solder JointsMORGANA RIBAS; SIULI SARKAR; CARL BILGRIEN; TOM HUNSINGER20182018, vol.18, no.10
Enabling IPX Level 7/8 PCB Waterproof ProtectionANDRES HANAU; ERIC HANSON; EDWARD HUGHES20182018, vol.18, no.10
Richard Boyle, Henkel CorporationTrevor Galbraith20182018, vol.18, no.10