哈尔滨工业大学邓宗全院士团队
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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004~2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2018, vol.18, no.1 2018, vol.18, no.10 2018, vol.18, no.11 2018, vol.18, no.12 2018, vol.18, no.2 2018, vol.18, no.3
2018, vol.18, no.4 2018, vol.18, no.5 2018, vol.18, no.6 2018, vol.18, no.7 2018, vol.18, no.8 2018, vol.18, no.9

题名作者出版年年卷期
Don't Judge a Co-Worker by their Engineer-SpeakDUANE BENSON20182018, vol.18, no.5
IMAPS UK - MicroTech 2018Royal Holloway20182018, vol.18, no.5
Altek Electronics Partners with ErsaJOYCE MUSE20182018, vol.18, no.5
Moving ForwardWALT CUSTER; JONATHAN CUSTER20182018, vol.18, no.5
Smart LED Lighting Requires New Communications StrategiesRUSS SHARER20182018, vol.18, no.5
High Brightness LED MarketTrevor Galbraith20182018, vol.18, no.5
Advanced Packaging, X-Ray Inspection and the Humble LEDKeith Bryant20182018, vol.18, no.5
High Performance Electronic Interconnect Materials Characterization - Techniques & ChallengesNICHOLAS HERRICK; AMIT PATEL; GYAN DUTT20182018, vol.18, no.5
Indium Corporation adds two technical support engineersMeagan Sloan20182018, vol.18, no.5
CyberOptics Interview - Dr. Subodh KulkarniSubodh Kulkarni20182018, vol.18, no.5
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