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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004～2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
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2024

2019, vol.19, no.1 2019, vol.19, no.10 2019, vol.19, no.11 2019, vol.19, no.12 2019, vol.19, no.2 2019, vol.19, no.3
2019, vol.19, no.4 2019, vol.19, no.5 2019, vol.19, no.6 2019, vol.19, no.8 2019, vol.19, no.9

题名作者出版年年卷期
Trends in Encapsulation of Electronic Components: Power electronics, increased requirements through miniaturizationKARL BITZER20192019, vol.19, no.4
Reflow Profiling for Next-Generation Solder AlloysMEAGAN SLOAN; KIM FLANAGAN; BROOK SANDY-SMITH; MB ALLEN20192019, vol.19, no.4
Time for the European EMS Market to be Consolidated: Katek SE Group has taken the first steps in that directionRAINER KOPPITZ20192019, vol.19, no.4
SiC Adoption is Accelerating: Is the Industrial Supply Chain Ready?CAMILLE VEYRIER20192019, vol.19, no.4
smtconnect: May 7-9, 2019, Messecentrum, Nuremberg, GermanyTrevor Galbraith20192019, vol.19, no.4
Some Bright Spots in a Difficult MarketTrevor Galbraith20192019, vol.19, no.4
ABchimie Interview - Jean-Pierre Douchy: Trevor Galbraith speaks with Jean-Pierre Douchy, Director of Sales at ABchimieTrevor Galbraith20192019, vol.19, no.4



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