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期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004~2024

关联期刊参考译名收藏年代
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2004 2005 2006 2007 2008 2009
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2024

2019, vol.19, no.1 2019, vol.19, no.10 2019, vol.19, no.11 2019, vol.19, no.12 2019, vol.19, no.2 2019, vol.19, no.3
2019, vol.19, no.4 2019, vol.19, no.5 2019, vol.19, no.6 2019, vol.19, no.8 2019, vol.19, no.9

题名作者出版年年卷期
The Fight for the Future of TechnologyTrevor Galbraith20192019, vol.19, no.8
Why Clean a No-Clean FluxEMILY PECK20192019, vol.19, no.8
Profab Invests in the Future with 3D AOI from Nordson YESTECHTrevor Galbraith20192019, vol.19, no.8
Laser Soldering Compression Method for Fine Pitch, Thin Die ApplicationsDENIS BARBINI20192019, vol.19, no.8
Koh Young Technology, Creating a Sensation for 3D AOITrevor Galbraith20192019, vol.19, no.8
Stretching ElectronicsJESSICA ABINERI20192019, vol.19, no.8
Easy and Flexible PCB Panel TestingMARTIN BADER; JURGEN HOLZINGER; OLAF ROHRBACHER20192019, vol.19, no.8
Industry 4.0 Demands the Co-Evolution of Workers and Manufacturing OperationsIRENE PETRICK; FAITH MCCREARY20192019, vol.19, no.8
Rod Howell, President of Libra IndustriesTrevor Galbraith20192019, vol.19, no.8
ASSOCIATION NEWSTrevor Galbraith20192019, vol.19, no.8