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期刊
ISSN
0946-7076
刊名
Microsystem technologies
参考译名
微系统技术:传感器,致动器与系统集成
收藏年代
1998~2024
关联期刊
参考译名
收藏年代
Journal of Information Storage and Processing Systems
存储与处理系统信息杂志
2000~2001
全部
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2020, vol.26, no.1
2020, vol.26, no.10
2020, vol.26, no.11
2020, vol.26, no.12
2020, vol.26, no.2
2020, vol.26, no.3
2020, vol.26, no.4
2020, vol.26, no.5
2020, vol.26, no.6
2020, vol.26, no.7
2020, vol.26, no.8
2020, vol.26, no.9
题名
作者
出版年
年卷期
Design of flexure-based modular architecture micro-positioning stage
Ding, Bingxiao; Yang, Zhixin; Li, Yangmin
2020
2020, vol.26, no.9
A micro monolithic integrated force-torque sensor with piezoelectric tuning mechanism
Meng, Ran; Zhang, Weiping; Zhou, Sui; Wang, Chenyang; Zhao, Jiaxin; Ge, Wei
2020
2020, vol.26, no.9
A hybrid system for imbalanced data mining
Lee, Zne-Jung; Lee, Chou-Yuan; Chou, So-Tsung; Ma, Wei-Ping; Ye, Fulan; Chen, Zhen
2020
2020, vol.26, no.9
MEMS based antenna of energy harvester for wireless sensor node
Yunus, Noor Hidayah Mohd; Sampe, Jahariah; Yunas, Jumril; Pawi, Alipah; Rhazali, Zeti Akma
2020
2020, vol.26, no.9
Dynamic characteristics and experiment of push-pull high-power ultrasonic consolidation resonance system for metal foil
Zhong, Xiangqiang; Huang, Weiqing; Fang, Huajie; Di, Zhimin; Wang, Yin
2020
2020, vol.26, no.9
Simulation, mathematical modeling, fabrication and experimental analysis of piezoelectric acoustic sensor for energy harvesting applications (vol 26, pg 1613, 2020)
Hegde, Vasudha; Yellampalli, Siva S.; Ravikumar, H. M.
2020
2020, vol.26, no.9
Development of stick-slip nanopositioning stage capable of moving in vertical direction
Pan, Peng; Zhu, Junhui; Gu, Sen; Ru, Changhai
2020
2020, vol.26, no.9
Bi-stability behavior in electrostatically actuated non-contact based micro-actuator
Ouakad, Hassen M.; Bahadur, Issam M.
2020
2020, vol.26, no.9
Material selection for optimum design of MEMS pressure sensors
Mehmood, Zahid; Haneef, Ibraheem; Udrea, Florin
2020
2020, vol.26, no.9
Monolithic integration of MEMS thermal flow sensor and its driving circuit onto flexible Cu on polyimide film
Kato, A.; Hasegawa, Y.; Taniguchi, K.; Shikida, M.
2020
2020, vol.26, no.9
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