哈尔滨工业大学邓宗全院士团队
      文献服务与管理平台

期刊


ISSN1474-0893
刊名Global SMT & Packaging
参考译名全球表面装配技术与包装——欧洲版
收藏年代2004~2024

关联期刊参考译名收藏年代
Test试验 


全部

2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2016 2017
2018 2019 2020 2021 2022 2023
2024

2020, vol.20, no.1 2020, vol.20, no.10 2020, vol.20, no.11 2020, vol.20, no.2 2020, vol.20, no.3 2020, vol.20, no.4
2020, vol.20, no.5 2020, vol.20, no.6 2020, vol.20, no.7 2020, vol.20, no.8 2020, vol.20, no.9

题名作者出版年年卷期
Did Technology Let Us Down?Trevor Galbraith20202020, vol.20, no.11
Everactive adopts Movellus Sub-Microwatt Clocking SolutionTrevor Galbraith20202020, vol.20, no.11
Plasmatreat Academy: A dialog between industry and scienceTrevor Galbraith20202020, vol.20, no.11
Solder Joint Reliability in Electronics - The Role of Fatigue - Part 3JENNIE S. HWANG20202020, vol.20, no.11
Core Manufacturing: ESD Flooring Selection and Requirement a Key Infrastructure RequirementANKAN MITRA20202020, vol.20, no.11
Automated and Efficient Processing of THTsHEIKE SCHLESSMANN20202020, vol.20, no.11
X-rays and X-ray Tubes - A Brief History - Part 1DAVID BERNARD20202020, vol.20, no.11
Walt CusterWalt Custer20202020, vol.20, no.11
Indium Corporation ultra-low residue fluxes for 5GTrevor Galbraith20202020, vol.20, no.11
Y-Quad junction box connector for the automotive sectorTrevor Galbraith20202020, vol.20, no.11
12