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期刊


ISSN0946-7076
刊名Microsystem technologies
参考译名微系统技术：传感器，致动器与系统集成
收藏年代1998～2024

关联期刊参考译名收藏年代
Journal of Information Storage and Processing Systems存储与处理系统信息杂志2000～2001


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2004 2005 2006 2007 2008 2009
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2016 2017 2018 2019 2020 2021
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2011, vol.17, no.1 2011, vol.17, no.10/11 2011, vol.17, no.12 2011, vol.17, no.2 2011, vol.17, no.3 2011, vol.17, no.4
2011, vol.17, no.5/7 2011, vol.17, no.8 2011, vol.17, no.9

题名作者出版年年卷期
A novel chip-on-glass method for slim LCD packagingYou-Hung Lin; Kang J. Chang; Gou-Jen Wang20112011, vol.17, no.4
Leak detection methods for glass capped and polymer sealed MEMS packagingSuzanne Millar; Marc P. Y. Desmulliez; Stewart McCracken20112011, vol.17, no.4
The thermal evaluation of the substrate mixed with microencapsulated phase change materials for MEMS packaging applicationsWei-Tzuo Lin; De-Shau Huang; Ming-Tzer Lin; Chi-Ming Lai20112011, vol.17, no.4
Measurement of static and dynamic mechanical behavior of micro and nano-scale thin metal films: using micro-cantilever beam deflectionYa-Chi Cheng; Chi-Jia Tong; Ming-Tzer Lin20112011, vol.17, no.4
The use of pulsed laser deposition to produce low-temperature barium titanate films on nickel tape and carbon fiber fabricG. Collins; D. Elam; R. Hackworth; R. Kotha; A. Ayon; A. Chabanov; C. L. Chen20112011, vol.17, no.4
Parametric study of flip-chip packaging for an MEMS device with diaphragmCheng-Hsin Chuang; Wen-Hui Li; Shin-Li Lee20112011, vol.17, no.4
Structure modification of M-AFM probe for the measurement of local conductivityA. Fujimoto; L. Zhang; A. Hosoi; Y. Ju20112011, vol.17, no.4
Fabrication of a metal protector for a fiber sensor using through-mask electrochemical micromachining with pulse DC powerWei-Te Wu; Wei-Hung Shih; Chih-To Wang20112011, vol.17, no.4
Simulation of maximum power in the wearable thermoelectric generator with a small thermopileVladimir Leonov20112011, vol.17, no.4
Fabrication of wireless sensors on flexible film using screen printing and via fillingC. W. P. Shi; Xuechuan Shan; G. Tarapata; R. Jachowicz; J. Weremczuk; H. T. Hui20112011, vol.17, no.4
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