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期刊


ISSN0946-7076
刊名Microsystem technologies
参考译名微系统技术:传感器,致动器与系统集成
收藏年代1998~2023

关联期刊参考译名收藏年代
Journal of Information Storage and Processing Systems存储与处理系统信息杂志2000~2001


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2016 2017 2018 2019 2020 2021
2022 2023

2011, vol.17, no.1 2011, vol.17, no.10/11 2011, vol.17, no.12 2011, vol.17, no.2 2011, vol.17, no.3 2011, vol.17, no.4
2011, vol.17, no.5/7 2011, vol.17, no.8 2011, vol.17, no.9

题名作者出版年年卷期
Integrated micro Pirani gauge based hermetical package monitoring for uncooled VO_x bolometer FPAsBin Xiao; Tao Dong; Einar Halvorsen; Zhaochu Yang; Yulong Zhang; Nils Hoivik; Dandan Gu; Nhut Minh Tran; Henrik Jakobsen20112011, vol.17, no.1
Study on the bimodal filler influence on the effective thermal conductivity of thermal conductive adhesiveYan Zhang; Jing-yu Fan; Cong Yue; Johan Liu; Masahiro Inoue20112011, vol.17, no.1
Fabrication of GaN light emitting diode membrane on Si substrate for MEMS applicationsM. Wakui; H. Sameshima; F.-R. Hu; K. Hane20112011, vol.17, no.1
Morphology and magnetic properties of electroplated Co-rich Co-Zn thin filmsTzu-Shun Yang; Naigang Wang; David P. Arnold20112011, vol.17, no.1
Surface micromachining of unfired ceramic sheetsJonathan M. Rheaume; Albert P. Pisano20112011, vol.17, no.1
Active magnetic inertia latch for hard disk drivesBu Hyun Shin; Kyung-Ho Kim; Seung-Yop Lee20112011, vol.17, no.1
Microstructures for characterization of seebeck coefficient of doped polysilicon filmsJin Xie; Chengkuo Lee; Ming-Fang Wang; Julius Minglin Tsai20112011, vol.17, no.1
A hybrid capacitive pressure and temperature sensor fabricated by adhesive bonding technique for harsh environment of kraft pulp digestersAbdolreza R. Mohammadi; Chad P. J. Bennington; Mu Chiao20112011, vol.17, no.1
Design of MEMS switch for RF applicationsN. J. R. Muniraj; K. Sathesh20112011, vol.17, no.1
A MEMS guide plate for a high temperature testing of a wafer level packaged die waferWoo-Chang Choi; Jee-Youl Ryu20112011, vol.17, no.1
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