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期刊


ISSN0946-7076
刊名Microsystem technologies
参考译名微系统技术：传感器，致动器与系统集成
收藏年代1998～2023

关联期刊参考译名收藏年代
Journal of Information Storage and Processing Systems存储与处理系统信息杂志2000～2001


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1998 1999 2000 2001 2002 2003
2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015
2016 2017 2018 2019 2020 2021
2022 2023

2011, vol.17, no.1 2011, vol.17, no.10/11 2011, vol.17, no.12 2011, vol.17, no.2 2011, vol.17, no.3 2011, vol.17, no.4
2011, vol.17, no.5/7 2011, vol.17, no.8 2011, vol.17, no.9

题名作者出版年年卷期
A novel chip-on-glass method for slim LCD packagingYou-Hung Lin; Kang J. Chang; Gou-Jen Wang20112011, vol.17, no.4
Leak detection methods for glass capped and polymer sealed MEMS packagingSuzanne Millar; Marc P. Y. Desmulliez; Stewart McCracken20112011, vol.17, no.4
The thermal evaluation of the substrate mixed with microencapsulated phase change materials for MEMS packaging applicationsWei-Tzuo Lin; De-Shau Huang; Ming-Tzer Lin; Chi-Ming Lai20112011, vol.17, no.4
Measurement of static and dynamic mechanical behavior of micro and nano-scale thin metal films: using micro-cantilever beam deflectionYa-Chi Cheng; Chi-Jia Tong; Ming-Tzer Lin20112011, vol.17, no.4
The use of pulsed laser deposition to produce low-temperature barium titanate films on nickel tape and carbon fiber fabricG. Collins; D. Elam; R. Hackworth; R. Kotha; A. Ayon; A. Chabanov; C. L. Chen20112011, vol.17, no.4
Parametric study of flip-chip packaging for an MEMS device with diaphragmCheng-Hsin Chuang; Wen-Hui Li; Shin-Li Lee20112011, vol.17, no.4
Structure modification of M-AFM probe for the measurement of local conductivityA. Fujimoto; L. Zhang; A. Hosoi; Y. Ju20112011, vol.17, no.4
Fabrication of a metal protector for a fiber sensor using through-mask electrochemical micromachining with pulse DC powerWei-Te Wu; Wei-Hung Shih; Chih-To Wang20112011, vol.17, no.4
Simulation of maximum power in the wearable thermoelectric generator with a small thermopileVladimir Leonov20112011, vol.17, no.4
Fabrication of wireless sensors on flexible film using screen printing and via fillingC. W. P. Shi; Xuechuan Shan; G. Tarapata; R. Jachowicz; J. Weremczuk; H. T. Hui20112011, vol.17, no.4
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